ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,795, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hyo Sung Choi (Suwon-si, South Korea), Jung Jin Park (Suwon-si, South Korea), Ho Sam Choi (Suwon-si, South Korea), Dae Jin Shim (Suwon-si, South Korea), Seung Yong Lee (Suwon-si, South Korea), Yong Hwa Lee (Suwon-si, South Korea) and Jong Ho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a capacitance formation portion including a dielectric layer and i...