ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,789, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Chan Ho Yang (Suwon-si, South Korea), Seong Hyeon Cho (Suwon-si, South Korea), Seung Min Kang (Suwon-si, South Korea) and Dae Hee Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion ...