US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Nov. 3 for "Multilayer electronic component having improved moisture resistance reliability" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,982, issued on Nov. 3, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component having improved moisture resistance reliability" was invented by Young Bin Jeong (Suwon-si, South Korea), Hyung Jong Choi (Suwon-si, South Korea), Kwan Hee Yun (Suwon-si, South Korea), Hyun Tak Kim (Suwon-si, South Korea), Jin Sung Lee (Suwon-si, South Korea), Boo Min Noh (Suwon-si, South Korea) and Min Woo Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the d...