US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Nov. 3 for "Multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,983, issued on Nov. 3, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by Dong Ha Kang (Suwon-si, South Korea), Hye Min Bang (Suwon-si, South Korea), Hye Young Choi (Suwon-si, South Korea), Bum Suk Kang (Suwon-si, South Korea), Hyun Hee Gu (Suwon-si, South Korea), Byung Jun Jeon (Suwon-si, South Korea) and Hong Seok Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an interfacial plating layer disposed ...