ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,157, issued on Nov. 3, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea).
"Circuit board" was invented by Ho-Jae Lee (Suwon-si, South Korea), Bongbu Jung (Suwon-si, South Korea) and Yeook Jeon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board is provided. The circuit board includes a substrate portion including at least one circuit wire, an adhesive layer disposed on a first side of the substrate portion, and a metal reinforcing layer disposed opposite to the substrate portion with respect to the adhesive layer, wherein the metal reinforcing layer includes a first surface which has a convex...