ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,531, issued on May 5, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Sin Il Gu (Suwon-si, South Korea), Jin Hyung Lim (Suwon-si, South Korea), Kang Ha Lee (Suwon-si, South Korea) and Jung Won Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion di...