ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,465, issued on May 19, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Kyung Sik Kim (Suwon-si, South Korea), Seung In Baik (Suwon-si, South Korea), Jong Hwan Lee (Suwon-si, South Korea) and Min Young Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces in the first direction, third and fourth surfaces in a...