US Patent Issued to SAMSUNG ELECTRO-MECHANICS on May 19 for "Multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,461, issued on May 19, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by Yong Park (Suwon-si, South Korea), Jung Jin Park (Suwon-si, South Korea), Kwan Soo Park (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Chang Ho Seo (Suwon-si, South Korea), Sun Mi Kim (Suwon-si, South Korea) and Hyun Sik Chae (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer interposed...