US Patent Issued to SAMSUNG ELECTRO-MECHANICS on March 31 for "Multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,340, issued on March 31, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by Byung Woo Kang (Suwon-si, South Korea), Bon Seok Koo (Suwon-si, South Korea), Jeong Ryeol Kim (Suwon-si, South Korea), Jung Min Kim (Suwon-si, South Korea), Jae Seok Yi (Suwon-si, South Korea), Ji Hye Han (Suwon-si, South Korea) and Hye Jin Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second s...