US Patent Issued to SAMSUNG ELECTRO-MECHANICS on March 3 for "Capacitor component and semiconductor package including capacitor component" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,818, issued on March 3, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Capacitor component and semiconductor package including capacitor component" was invented by Jae Hoon Kim (Suwon-si, South Korea), Hye Jin Kim (Suwon-si, South Korea), Gyoung Heon Ko (Suwon-si, South Korea) and Jang Won Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A capacitor component includes a support member; capacitance laminates laminated on one surface of the support member; at least one insulating layer disposed between the capacitance laminates; and a plurality of through structures each penetrating through at lea...