US Patent Issued to SAMSUNG ELECTRO-MECHANICS on March 24 for "Multilayer electronic component and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,719, issued on March 24, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method of manufacturing the same" was invented by Chang Ho Seo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component and a method of manufacturing the same are disclosed. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and external electrodes disposed on the body and connected to the internal electrodes, wherein at least one of th...