ALEXANDRIA, Va., June 16 -- United States Patent no. 12,658,371, issued on June 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Sung Soo Kim (Suwon-si, South Korea), Jae Young Na (Suwon-si, South Korea), Jin Hyung Lim (Suwon-si, South Korea) and Jung Won Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode including a base electrode layer connected to the internal electrode, a thin film electrode layer disposed on the base elec...