US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 21 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,137, issued on July 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board" was invented by Yun Je Ji (Suwon-si, South Korea), Yong Hoon Kim (Suwon-si, South Korea), Seung Eun Lee (Suwon-si, South Korea) and Joo Hwan Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a first board unit including a plurality of first insulating layers and a plurality of first wiring layers respectively disposed on or in the plurality of first insulating layers; a second board unit including one or more second insulating layers and one or more second wiring layers...