US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 21 for "Circuit board and method for manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,140, issued on July 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Circuit board and method for manufacturing the same" was invented by Myungju Gi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a circuit board including: an insulation layer for burying at least one wire layer and at least one via layer and having a first side and a second side facing each other, and a first wire layer partly protruding over the first side of the insulation layer and partly buried in the insulation layer, wherein the insulation layer has a concave cavity dented from the first side, and part of the ...