US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 14 for "Multilayer electronic component with improved cover and margin portions" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,078, issued on July 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component with improved cover and margin portions" was invented by Han Sol Yun (Suwon-si, South Korea), Sung Chul Bae (Suwon-si, South Korea), Ji Hyun Yu (Suwon-si, South Korea), Sung Hyung Kang (Suwon-si, South Korea) and Hye Won Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a capacitance formation portion that is a region a dielectric layer and internal electrodes alternately arranged with the dielectric layer interposed therebetween in a f...