US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 14 for "Electronic component and substrate with electronic component embedded therein" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,080, issued on July 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Electronic component and substrate with electronic component embedded therein" was invented by Ho In Jun (Suwon-si, South Korea), Eon Ju Noh (Suwon-si, South Korea), Myung Duk Seo (Suwon-si, South Korea), Kyeong Jun Kim (Suwon-si, South Korea), Kyo Sik Kim (Suwon-si, South Korea) and Da Jeong Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, connected to the internal electrode, and inc...