ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,313, issued on Feb. 24, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hye Won Ryoo (Suwon-si, South Korea), Kyung Sik Kim (Suwon-si, South Korea), Seung In Baik (Suwon-si, South Korea), Min Young Choi (Suwon-si, South Korea), Jong Hwan Lee (Suwon-si, South Korea) and Hyung Soon Kwon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric...