US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Feb. 17 for "Multilayer electronic component with enhanced electrode connectivity using Ni and Al oxide" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,720, issued on Feb. 17, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component with enhanced electrode connectivity using Ni and Al oxide" was invented by Gil Yong Lee (Suwon-si, South Korea), Su Ji Kang (Suwon-si, South Korea), Mun Seong Jeong (Suwon-si, South Korea), Jin Kyung Park (Suwon-si, South Korea), Chang Soo Jang (Suwon-si, South Korea), Sun Il Jeong (Suwon-si, South Korea), Hyun Jun Hwang (Suwon-si, South Korea) and Jung Min Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and intern...