ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,158, issued on Feb. 17, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea).
"Acoustic resonator package" was invented by Tae Kyung Lee (Suwon-si, South Korea), Sung Han (Suwon-si, South Korea) and Jae Goon Aum (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other. The cap includes a central portion accommodating the acoustic resonator, and an outer portion disposed outside of the ce...