US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Aug. 4 for "Multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,542, issued on Aug. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by Yong Park (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Jung Jin Park (Suwon-si, South Korea), Su Min Kim (Suwon-si, South Korea), Eun Jung Lee (Suwon-si, South Korea), Yong Min Hong (Suwon-si, South Korea), Ji Hyeon Lee (Suwon-si, South Korea), Sim Chung Kang (Suwon-si, South Korea), Min Woo Kim (Suwon-si, South Korea) and Jung Tae Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and ...