US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Aug. 11 for "Method of manufacturing a multilayer ceramic electronic component having protrusions at one ends of internal electrodes" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,246, issued on Aug. 11, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Method of manufacturing a multilayer ceramic electronic component having protrusions at one ends of internal electrodes" was invented by Hyung Duk Yun (Suwon-si, South Korea), Young Hoon Song (Suwon-si, South Korea), Dong Hwi Shin (Suwon-si, South Korea), Seon Young Yoo (Suwon-si, South Korea) and Yu Seop Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes ...