ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,229, issued on April 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayered electronic component" was invented by Byung Hun Lee (Suwon-si, South Korea), Sang Won Choi (Suwon-si, South Korea), Kun Hoi Koo (Suwon-si, South Korea) and Ho Jae Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body having a first internal electrode, a second internal electrode, and a first auxiliary electrode and a second auxiliary electrode spaced apart from each other, in which the first internal electrode and the second internal electrode are alternately arrange...