ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,990, issued on Aug. 11, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea).
"Semiconductor package film and manufacturing method thereof" was invented by Ji Ye Lee (Yongin-si, South Korea), Ho Suk Maeng (Yongin-si, South Korea) and Soo Yeon Kim (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package film includes a base film having sprocket holes arranged in a first direction in an edge area at a periphery of a main area. The edge area is adjacent to the main area in a second direction intersecting the first direction. The semiconductor package film includes a circuit line disposed in the main ar...