ALEXANDRIA, Va., Feb. 17 -- United States Patent no. D1,114,290, issued on Feb. 17, was assigned to Sakura Medical Science Technology (Taizhou) Co. Ltd. (Taizhou, China).
"Embedding module" was invented by Wei Zhang (Beijing), Takeshi Funaya (Beijing) and Jun Jin (Beijing).
The patent was filed on June 21, 2024, under Application No. D/948,634.
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