US Patent Issued to Rohm on Sept. 29 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,333, issued on Sept. 29, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device" was invented by Isamu Nishimura (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element including a first coil; a second coil magnetically coupled to the first coil; and a support substrate on which the first semiconductor element and the second semiconductor element are mounted. The support substrate includes an insulating base member, and a substrate wiring formed on the base member. The substrate wiring includes a first wiring membe...