US Patent Issued to Rohm on Sept. 22 for "Semiconductor device provided with insulating element bonded to insulating substrate" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,655, issued on Sept. 22, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device provided with insulating element bonded to insulating substrate" was invented by Yoshizo Osumi (Kyoto, Japan), Hiroaki Matsubara (Kyoto, Japan), Tomohira Kikuchi (Kyoto, Japan) and Taro Nishioka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a plurality of conductive members including a die pad, a first semiconductor element and a second semiconductor element each located on the die pad, an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insul...