US Patent Issued to Rohm on Oct. 6 for "Semiconductor device with reverse and observe surfaces" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,752, issued on Oct. 6, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device with reverse and observe surfaces" was invented by Daichi Niwa (Kyoto, Japan), Yuki Seta (Kyoto, Japan) and Koshun Saito (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device capable of suppressing separation of a sealing resin at an internal reverse surface is provided. The semiconductor device includes a semiconductor element, a first lead on which the semiconductor element is mounted, and a sealing resin covering the semiconductor element and a part of the lead. The lead includes an obverse surface to which the semiconductor ele...