ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,766, issued on Oct. 6, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device" was invented by Eiji Kuwahara (Kyoto, Japan), Toru Higuchi (Kyoto, Japan) and Daisuke Sakizono (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate, a first electroconductive member that is formed on the semiconductor substrate and that has a first linear portion extending along a principal surface of the semiconductor substrate, and an organic insulation layer that is formed on the semiconductor substrate and that covers the first electroconductive member, and the first linear portion includes ...