US Patent Issued to ROHM on Oct. 27 for "Semiconductor device and semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,663, issued on Oct. 27, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device and semiconductor module" was invented by Bungo Tanaka (Kyoto, Japan), Kazumasa Nishio (Kyoto, Japan) and Kosei Osada (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a substrate-side insulating layer disposed on the semiconductor substrate. The substrate-side insulating layer includes: a first oxide film; a second oxide film, disposed on the first oxide film and separated from the first oxide film; and a first nitride insulating...