US Patent Issued to ROHM on Oct. 27 for "Semiconductor device, semiconductor module, motor drive device, and vehicle" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,925, issued on Oct. 27, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device, semiconductor module, motor drive device, and vehicle" was invented by Bungo Tanaka (Kyoto, Japan) and Keiji Wada (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor layer that has a principal surface, a first conductive layer that is formed on the principal surface of the semiconductor layer, a first insulating portion that is formed on the principal surface of the semiconductor layer so as to cover the first conductive layer and that includes a first insulating layer of at least three or more layers,...