US Patent Issued to Rohm on Nov. 3 for "Semiconductor device with different side surfaces thickness for a plurality of leads that extend outside the package" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,800, issued on Nov. 3, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device with different side surfaces thickness for a plurality of leads that extend outside the package" was invented by Masato Ikeda (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a plurality of terminals arranged along a first direction, a semiconductor element electrically connected to at least one of the plurality of terminals, and a sealing resin covering a part of each of the plurality of terminals and covering the semiconductor element. Each of the plurality of terminals includes a mount surface exposed from the seal...