ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,171, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Pressure sensor module" was invented by Hajime Watanabe (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a sensor module including a box-shaped structure that includes a bottom surface portion and a side surface portion arranged upright with respect to the bottom surface portion, a sensor unit that is mounted on the bottom surface portion of the box-shaped structure and that includes a pressure sensor body, and a cover member that is placed on the side surface portion in such a manner as to cover the sensor unit, in which an opening for allowing communicatio...