ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,556, issued on May 19, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Koshun Saito (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, first and second leads, and a sealing resin. The semiconductor element includes first and second electrodes. The first lead includes a mounting base having a main face to which the first electrode is bonded and a back face, and includes a first terminal connected to the first electrode. The second lead includes a second terminal connected to the second electrode. The sealing resin includes a main face and a back fac...