ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,555, issued on June 30, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device" was invented by Ryuta Yaginuma (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor switching element, a first lead with the semiconductor element mounted thereon, a second lead, and a sealing resin. The second lead is spaced from the first lead in a first direction perpendicular to a thickness direction of the semiconductor element. The sealing resin covers a portion of the first lead, a portion of the second lead, and the semiconductor element. A resin reverse surface of the sealing resin includes a f...