US Patent Issued to ROHM on June 23 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,975, issued on June 23, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device" was invented by Kenji Fujii (Kyoto, Japan) and Akinori Nii (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a conductor, a semiconductor element, and a bonding layer. The conductor has obverse surfaces and reverse surfaces facing away from each other in a thickness direction. The semiconductor element has a body layer and electrodes projecting toward the obverse surfaces from a side of the body layer that opposes the obverse surfaces in the thickness direction. The bonding layer bonds the obverse surfaces and the e...