US Patent Issued to ROHM on July 7 for "Semiconductor device including a substrate to which a lead is fixed" (Japanese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,714, issued on July 7, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device including a substrate to which a lead is fixed" was invented by Hiroyuki Tajiri (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device, includes: a substrate having an obverse surface facing in a thickness direction; a first lead having a loading surface facing a side same as a side the obverse surface faces as to the thickness direction and being fixed on the obverse surface; and a first semiconductor element arranged on the loading surface. A dimension of the substrate in a first direction orthogonal to the thickness direction is ...