ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,788, issued on July 28, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Kazunori Fuji (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an insulation layer, wires, a semiconductor element, and an encapsulation resin. The insulation layer includes a main surface and a back surface facing opposite in a thickness-wise direction and a side surface formed between the main surface and the back surface in the thickness-wise direction. The wires include an embedded portion embedded in the insulation layer and a redistribution por...