US Patent Issued to ROHM on Feb. 17 for "Semiconductor element, semiconductor device including the semiconductor element, and semiconductor element manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,605, issued on Feb. 17, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor element, semiconductor device including the semiconductor element, and semiconductor element manufacturing method" was invented by Yuji Koga (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor element including a semiconductor substrate; a semiconductor layer laminated to the semiconductor substrate, and having a circuit formed within the semiconductor layer; a conductive layer disposed on an opposite side of the semiconductor layer from the semiconductor substrate and including a part electrically connected to the circuit; and a...