ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,618, issued on Feb. 17, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Bungo Tanaka (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor layer, an element isolation portion that is formed at the semiconductor layer and that defines an element region in the semiconductor layer, and a first contact that is formed in a linear shape along the element isolation portion in a plan view and that is electrically connected to the element isolation portion. The semiconductor device further includes a semiconductor substrate supporting the semiconductor layer and a bur...