ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,641, issued on Aug. 4, was assigned to Rohm Co. Ltd. (Kyoto, Japan).
"Semiconductor device and ultrasonic sensor" was invented by Hideki Matsubara (Kyoto, Japan), Yoshiaki Kono (Kyoto, Japan) and Ken Hashimoto (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a driving circuit arranged to be capable of supplying a drive signal in an ultrasonic band to a piezoelectric element, a damping circuit having a resistance load and an inductive load, and a control circuit arranged to be capable of controlling the driving circuit and performing a reverberation reduction operation after stopping the supply of the drive ...