US Patent Issued to Rohm on Aug. 25 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,187, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device" was invented by Kenji Fujii (Kyoto, Japan), Taro Nishioka (Kyoto, Japan) and Shinya Hikita (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes leads each having an obverse surface facing in a thickness direction and extending in a first direction crossing the thickness direction, a semiconductor element including electrodes connected to the obverse surfaces of the leads, and a sealing resin covering the leads and semiconductor element. The sealing resin includes a resin bottom surface opposite from the semiconductor e...