ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,212, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan).
"Semiconductor device" was invented by Tsunehisa Ono (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: semiconductor element; first lead having first section carrying the semiconductor element; second lead separated from the first lead and connected to the semiconductor element; and resin section covering the semiconductor element and portions of the first and second leads. The first section has first obverse surface and first reverse surface mutually facing away in a thickness direction. The semiconductor element has element obverse sur...