US Patent Issued to ROHM on Aug. 11 for "Semiconductor device with wire including a surface metal layer covering a core metal" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,043, issued on Aug. 11, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device with wire including a surface metal layer covering a core metal" was invented by Hiroaki Matsubara (Kyoto, Japan), Taro Nishioka (Kyoto, Japan), Yoshizo Osumi (Kyoto, Japan), Tomohira Kikuchi (Kyoto, Japan), Moe Yamaguchi (Kyoto, Japan) and Ryohei Umeno (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes first and second semiconductor elements, and first and second circuits at different potentials. The second semiconductor element, electrically connected to the first semiconductor element, relays mutual signals between...