US Patent Issued to ROHM on Aug. 11 for "Semiconductor device with a surface of a semiconductor body exposed through an opening in a sealing resin" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,995, issued on Aug. 11, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device with a surface of a semiconductor body exposed through an opening in a sealing resin" was invented by Kengo Ohmori (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a conductor, a semiconductor element, and a sealing resin. The conductor has an obverse surface facing in the thickness direction. The semiconductor element includes an element body and a plurality of electrodes connected to the element body and bonded to the obverse surface. The sealing resin covers the semiconductor element. The sealing resin has a top ...