US Patent Issued to Rohm on Aug. 11 for "Semiconductor device provided with electroconductive support containing non-magnetic material for mounting semiconductor elements" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,991, issued on Aug. 11, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device provided with electroconductive support containing non-magnetic material for mounting semiconductor elements" was invented by Hiroaki Matsubara (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: an electroconductive support including leads; a first semiconductor element supported by the support; a second semiconductor element supported by the support; a third semiconductor element supported by the support, electrically connected to the first and the second semiconductor elements, and insulating the first and the seco...