US Patent Issued to Rockwell Collins on June 30 for "Packaging architecture for a high frequency active electronically scanned array" (Iowa Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,238, issued on June 30, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa).

"Packaging architecture for a high frequency active electronically scanned array" was invented by Ross K. Wilcoxon (Cedar Rapids, Iowa) and Jeremiah D. Wolf (Atkins, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging architecture for a high frequency active electronically scanned array is described. The packaging architecture enables the thermal management benefits of a card-fed approach to be extended to higher-frequency AESA to operate with higher output power and/or duty cycle. The packaging architecture includes circuit cards that are non-rectangular...