US Patent Issued to Rockwell Collins on July 7 for "Methods for promoting selective copper foil adhesion in a printed circuit board" (Iowa Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,377, issued on July 7, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa).

"Methods for promoting selective copper foil adhesion in a printed circuit board" was invented by James B. Mayfield (Cedar Rapids, Iowa) and John A. Bauer (Marion, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a printed circuit board (PCB) including selectively etching copper foil at mapped areas corresponding to predefined radio-frequency (RF) signal performance of a device, for instance an active electrically scanned array (AESA). In embodiments, first and second RF performance areas of a device are mapped, the copper foil is etched at s...