ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,066, issued on Feb. 17, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).
"Wafer with buried V-groove cavity for fiber coupling" was invented by Janne Ikonen (Espoo, Finland), John Paul Drake (St. Ives, Great Britain), Henri Nykanen (Helsinki) and Damiana Lerose (Pasadena, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer with a buried V-groove cavity, and a method for fabricating V-grooves. In some embodiments, the method includes bonding a first layer, to a top surface of a substrate, to form a composite wafer, the first layer being composed of a first semiconductor material, the substrate being composed of a second s...