US Patent Issued to Robert Bosch on Nov. 3 for "Prediction of failure probabilities of chips of a wafer" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,439, issued on Nov. 3, was assigned to Robert Bosch GmbH (Stuttgart, Germany).

"Prediction of failure probabilities of chips of a wafer" was invented by Eric Sebastian Schmidt (Heimsheim, Germany) and Stefan Patrick Lindt (Ettlingen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method is for teaching a machine learning system to predict failure probabilities of chips on a wafer. The method is based on a prediction of final test yields depending on wafer-level test measurements by the machine learning system. The machine learning system predicts the failure probabilities of the chips depending on the wafer-level test measurements, and the ...