US Patent Issued to ROBERT BOSCH on May 26 for "Semiconductor component and method for manufacturing a semiconductor component" (German Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,823, issued on May 26, was assigned to ROBERT BOSCH GMBH (Stuttgart, Germany).

"Semiconductor component and method for manufacturing a semiconductor component" was invented by Alberto Martinez-Limia (Tuebingen, Germany), Alfred Goerlach (Kusterdingen, Germany), Holger Bartolf (Ofterdingen, Germany), Stephan Schwaiger (Bodelshausen, Germany) and Wolfgang Feiler (Reutlingen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component. The semiconductor component includes a semiconductor substrate that includes a first side, on which an epitaxial layer is situated. On the epitaxial layer, body regions are sectionally situated, and o...